|
TYZ
|
Teledyne Technologies Incorporated
|
DE
|
F
|
|
UBE
|
Ube Industries Ltd
|
DE
|
F
|
|
UCE
|
Ultra Clean Holdings Inc
|
DE
|
F
|
|
UMCB
|
United Microelectronics Corporation
|
DE
|
F
|
|
VAN
|
Advantest Corporation
|
DE
|
F
|
|
VANA
|
ADVANTEST ADR NEW/1 O.N.
|
DE
|
F
|
|
VAYA
|
Vaisala Oyj
|
DE
|
F
|
|
VEO
|
Veeco Instruments Inc
|
DE
|
F
|
|
VHY
|
Vishay Intertechnology Inc
|
DE
|
F
|
|
VNI
|
Avnet Inc
|
DE
|
F
|
|
VNX
|
NXP Semiconductors N.V.
|
DE
|
F
|
|
WAF
|
Siltronic AG
|
DE
|
F
|
|
WCE
|
CECO Environmental Corp
|
DE
|
F
|
|
WCH
|
Wacker Chemie AG
|
DE
|
F
|
|
XS4
|
ON Semiconductor Corporation
|
DE
|
F
|
|
XSDG
|
Samsung SDI Co. Ltd
|
DE
|
F
|
|
XXA1
|
Axcelis Technologies Inc
|
DE
|
F
|
|
YEC
|
YASKAWA Electric Corporation
|
DE
|
F
|
|
YEC0
|
YASKAWA ELEC. UNSP. ADR 2
|
DE
|
F
|
|
BIP-UN
|
Brookfield Infrastructure Partners L.P
|
CA
|
TO
|