Description: LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as tape carrier packages, chip on glass, and chip on films; solder bumps for various flip chip packages; Cu pillar bumps; gold RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides wafer test solutions, including O/S and function checks; and back-end services, such as back grinding, laser marking, dicing saw, and visual inspection, as well as drop ship services. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek, South Korea.
Home Page: www.lbsemicon.com
138, Cheongbuksandan-ro
Pyeongtaek-Si,
South Korea
Phone:
82 3 1680 1600
Officers
| Name | Title |
|---|---|
| Mr. Noh-Man Park | Chief Exec. Officer |
| Baek Young-Ki | Exec. |
Exchange: KQ
Country: KR
Currency: Korean Won (₩)
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 0 |
| Price-to-Book MRQ: | 0 |
| Price-to-Sales TTM: | 0.6407 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 609 |