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DAP Corporation(066900)

Description: DAP Corporation provides printed circuit boards South Korea and internationally. Its products are used in mobile phones, tablet PCs, wearables, and automobiles. The company also provides construction equipment, such as CNC drill, laser drill, router, oxide, lay-up, hot press, desmear, chemical plating, electrolytic plating, exposure, etching, AOI, photo solder resist, electroness nikel immersion gold, and organic solderability preservatives. The company was founded in 1987 and is headquartered in Anseong, South Korea.


Keywords: Electromagnetism Electrical Engineering Laser Electronic Engineering Mobile Phone Construction Equipment Printed Circuit Board Electronics Manufacturing Coatings Plating Soldering Solder Chemical Plating

Home Page: www.dap.co.kr

474-22, Anseongmatchum-daero
Anseong-si,
South Korea
Phone: 82 3 1677 0005


Officers

Name Title
Bong-Yoon Choi CEO & Pres
Seon-Ho Lee Managing Director
Ki-Dong Kim Sr. Managing Director
Seong-Su Kim Managing Director
Oh Il Kwon Chairman & CEO
Jae-Hwan Oh Managing Director

Exchange: KQ

Country: KR

Currency: Korean Won (₩)

Forward PE: 0
Trailing PE: 0
Price-to-Book MRQ: 0
Price-to-Sales TTM: 0.1702
IPO Date:
Fiscal Year End: December
Full Time Employees: 0
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