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HANA Micron Inc(067310)

Description: HANA Micron Inc. provides semiconductor packaging solutions and test manufacturing services in South Korea and internationally. Its packaging products include flip chip ball grid array, BGA H/S, FBGA, FBGA capillary underfill, and molded underfill products; flexible packaging solution for Silicon-based IC chips; bumping products; WLP DSPs; fingerprint sensor assemblies; SIP and EMI shields; FBGA, such as multi-chip PKG; lead frame bases, including quad flat no lead, thin small outline, thin shrink small outline, and quad flat packages; and technology products. The company also offers test services comprising RF, SOC, analog, and logic test services; and test technical support and test auto loading management system services, as well as test equipment products. In addition, it manufactures and sells silicon cathodes, ingot, and rings used in semiconductor and solar industries. The company was founded in 2001 and is headquartered in Asan, South Korea.


Keywords: Semiconductor Electrical Engineering Packaging Electronic Engineering Integrated Circuits Semiconductor Device Fabrication Technology Products Flip Chip Integrated Circuit Packaging Test Services Ball Grid Array Hana Micron

Home Page: www.hanamicron.com

#77 Yeonamyulgeum-ro
Asan-Si, 336-864
South Korea
Phone: 82 4 1423 7777


Officers

Name Title
Mr. Chang-Ho Choi Chief Exec. Officer and Pres
Mr. Dong-Kook Shin Chief Financial Officer and Managing Director
Mr. Young-Nam Cho Sr. Managing Director and Director
Mr. Gwang-Eun Kim Sr. Managing Director
Yong-An Kwon Managing Director
Ki-Su Yu Sr. Managing Director and Director
Hyeok Lee R&D Director and Director

Exchange: KQ

Country: KR

Currency: Korean Won (₩)

Forward PE: 0
Trailing PE: 0
Price-to-Book MRQ: 0
Price-to-Sales TTM: 0.3638
IPO Date: 2005-10-11
Fiscal Year End: December
Full Time Employees: 715
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