Description: Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic component keep being developed; and solder powder, a substance of solder paste that is used for soldering PCBs and devices. The company also provides anisotropic conductive film (ACF) for directional electrical contact and chemical bonding, such as display, drive IC, PCB, etc.; conductive particle, a component of ACF that anisotropically controls electrical current; cored solder ball, which forms bumps between a substrate and a chip; low alpha tin for solving the problem of soft errors occurred in chips; silver nanowires; thermally conductive pastes; and EMI shielding pastes. The company was founded in 1999 and is headquartered in Ulsan, South Korea. Duksan Hi Metal Co.,Ltd is a subsidiary of DUKSAN group.
Home Page: www.dshm.co.kr
66, Muryong 1-ro
Ulsan,
South Korea
Phone:
82 5 2283 9000
Officers
| Name | Title |
|---|---|
| Mr. Jun-Ho Lee | Co-CEO & Representative Director |
| Gil-Yeon Kim | Co-Chief Exec. Officer |
| Mr. Su-Hoon Lee | Managing Director |
| Keum-Deuk Lee | Managing Director |
| Han-Sung Yoo | Sr. Managing Director |
| Young-Ro Choi | Managing Director |
| Seong-gi Kang | Managing Director |
Exchange: KQ
Country: KR
Currency: Korean Won (₩)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Semiconductors & Semiconductor Equipment |
| GIC Industry: | Semiconductors & Semiconductor Equipment |
| GIC Sub-Industry: | Semiconductors |
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 0 |
| Price-to-Book MRQ: | 0 |
| Price-to-Sales TTM: | 1.4932 |
| IPO Date: | 2005-10-14 |
| Fiscal Year End: | December |
| Full Time Employees: | 194 |