Description: Foxconn Technology Co., Ltd. manufactures, processes, and sells cases, heat dissipation modules, and consumer electronics products. It offers 3C product and alloy material. The company also engages in the research, development, manufacture, and sale of computer thermal modules, computer components, and aluminum magnesium cases; and manufacture and marketing of computer cases, new alloy materials, precision molds, electronic components, and portable computers and its components. In addition, it produces and sells aluminum alloy materials, rail vehicle components, car accessories and electronic components, structured metal products, metal containers, automobile parts, power plugs, wall sockets, and micro ribbon connectors, as well as aluminum alloy parts for automobiles and electronics. The company was founded in 1990 and is headquartered in New Taipei City, Taiwan.
Home Page: www.foxconntech.com.tw
No. 66-1, Zhongshan Road
New Taipei City,
Taiwan
Phone:
886 2 2268 0970
Officers
| Name | Title |
|---|---|
| Mr. Han-Ming Lee | Pres |
| Mr. Tzu Hung Li | Fin. Director & Head of Corp. Governance |
| Ms. Yuan-Wen Lan | Accounting Director |
Exchange: TW
Country: TW
Currency: New Taiwan Dollar (NT$)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Technology Hardware & Equipment |
| GIC Industry: | Electronic Equipment, Instruments & Components |
| GIC Sub-Industry: | Electronic Manufacturing Services |
| Forward PE: | 14.3062 |
|---|---|
| Trailing PE: | 17.0227 |
| Price-to-Book MRQ: | 0.7386 |
| Price-to-Sales TTM: | 0.8413 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 0 |