Description: Kinsus Interconnect Technology Corp. manufactures and sells electronic products in Taiwan and internationally. It operates through three segments: IC Substrate, Printed Circuit Board (PCB), and Optics. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and WiFi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company provides PCBs and related products, and electronic parts and components, as well as after sales services. Further, it is involved in the wholesale and retail-sale of electronic materials; manufacture and sale of medical equipment; provision of consultation services for business operation and management; investment and trading activities; and sale of cosmetic products. Additionally, the company produces, manufactures, and sells contact lens. It primarily serves manufacturers of electronic products. Kinsus Interconnect Technology Corp. was incorporated in 2000 and is headquartered in Taoyuan City, Taiwan.
Home Page: www.kinsus.com.tw
No. 1245, Chung Hua Road
Taoyuan City,
32747
Taiwan
Phone:
886 3 487 1919
Officers
Name | Title |
---|---|
Mr. Sih-Jheng Liao | Chairman & Deputy CSO |
Mr. He-Xu Chen | CEO & Director |
Ms. Su-Zhen Liu | Head of Corp. Governance, Fin. Supervisor & Sr. Director of Fin. Department |
Ms. Gui-Qin Hu | COO & Director |
Mr. Qian-Wei Zhang | CTO & Director |
Mr. Zi-Xian Tong | Chief Strategy Officer & Director |
Mr. Te-Sheng Yang | Sr. VP |
Exchange: TW
Country: TW
Currency: New Taiwan Dollar (NT$)
GIC Sector: | Information Technology |
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GIC Group: | Semiconductors & Semiconductor Equipment |
GIC Industry: | Semiconductors & Semiconductor Equipment |
GIC Sub-Industry: | Semiconductors |
Forward PE: | 7.0721 |
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Trailing PE: | 6.8021 |
Price-to-Book MRQ: | 1.5925 |
Price-to-Sales TTM: | 1.1855 |
IPO Date: | 2004-11-01 |
Fiscal Year End: | December |
Full Time Employees: | 0 |