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Winstek Semiconductor Co Ltd(3265)

Description: Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the research, development, and testing of integrated circuits in Taiwan. It offers wafer sort, final and post-test, engineering support, and test platforms services; copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, and backside metallization services; die processing, wafer thinning, singulation, and flip chip services; and failure analysis and reliability testing services. The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015. The company was founded in 2000 and is headquartered in Hsinchu, Taiwan. Winstek Semiconductor Co., Ltd. is a subsidiary of Ge-Shing Corporation.


Keywords: Electronics Semiconductor Electronic Engineering Integrated Circuits Semiconductor Device Fabrication Reliability Flip Chip Wafer Testing Chip Services Reliability Testing Services Wafer Backgrinding

Home Page: www.winstek.com.tw

No.176-5, 6 Ling
Hsinchu City, 307
Taiwan
Phone: 886 3 593 6565


Officers

Name Title
Mr. Chih Li Weng Pres, GM & Director
Mr. Kui-Chu Liu CFO, Accounting Officer & Fin. Division Deputy Director
Mr. Il Kwon Shim Chief Technology Officer and Sr. VP

Exchange: TWO

Country: TW

Currency: New Taiwan Dollar (NT$)

Forward PE: 0
Trailing PE: 7.1037
Price-to-Book MRQ: 1.1128
Price-to-Sales TTM: 1.6806
IPO Date:
Fiscal Year End: December
Full Time Employees: 0
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