Description: Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. Its products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. The company also offers substrate-based package, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is based in Kaohsiung, Taiwan.
Home Page: www.ticp.com.tw
Kaohsiung Export Processing Zone
Kaohsiung,
806
Taiwan
Phone:
886 7 815 8800
Officers
| Name | Title |
|---|---|
| Chung-Ho Tseng | Pres |
| Zhuo Jian Bin | Head of Accounting Department and Associate of Fin. Department |
| Su Jun Ren | VP of Operations |
| Guo Yuan Ping | VP of Sales |
| Su Ming Cong | Head of the Factory Affairs Department |
| Mr. Jiang Yu Cheng | Head of Logistic Resources Department |
| Mr. Shu Chong Zheng | Exec. Director |
Exchange: TWO
Country: TW
Currency: New Taiwan Dollar (NT$)
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 8.84 |
| Price-to-Book MRQ: | 0.9847 |
| Price-to-Sales TTM: | 1.3515 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 537 |