Description: Xintec Inc. operates as a three-dimensional (3D) wafer level chip scale packaging company in Taiwan, the United States, Europe, and internationally. The company offers optical sensor chip-scale package technology for cellular phones, notebooks, gesture sensors, and laser intensity sensor for blue-ray and pico projectors; PPI and 3D Package technologies for use in integrated passive devices, power management IC and analogue IC, cellular phone RF IC, and capacitive couplers; and Micro-Electro-Mechanical Systems (MEMS) and sensor packaging for ink printer heads, motion sensors, temperature and humidity sensors, pressure sensors, identification sensors, pico-projector heads, silicon microphones, and bio sensors. It also provides design and modeling services for its technologies. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan, Taiwan.
Home Page: www.xintec.com.tw
No. 23, Jilin Road
Taoyuan City,
32062
Taiwan
Phone:
886 3 433 1818
Officers
| Name | Title |
|---|---|
| Mr. Chia Hsiang Chen | Chairman, GM & Pres |
| Mr. Shu Min Lin | CFO & Sr. Director of Fin. |
| Ms. M. Y. Chu | VP of Operations |
| Mr. C. T. Chou | Head for Dept. of Legal Affairs, Company Supervisor, Corp. Governance Officer & Company Sec. |
| Mr. J. W. Ma | Sr. Director of Sales & QR |
Exchange: TWO
Country: TW
Currency: New Taiwan Dollar (NT$)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Semiconductors & Semiconductor Equipment |
| GIC Industry: | Semiconductors & Semiconductor Equipment |
| GIC Sub-Industry: | Semiconductors |
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 13.4615 |
| Price-to-Book MRQ: | 4.13 |
| Price-to-Sales TTM: | 3.5776 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 1592 |