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ASE Industrial Holding Co Ltd(3711)

Description: ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.


Keywords: Electronics Semiconductor Real Estate Properties Packaging Electronic Engineering Integrated Circuits Semiconductor Device Fabrication Electronics Manufacturing Telecommunications Equipment MEMS Electronic Manufacturing Service Integrated Circuit Packaging Automotive Electronic Products Ball Grid Array Wafer Level Packaging Chip Scale Package Semiconductor Testing Services Quad Flat No Leads Package Chip Carrier Offers Information Software System In Package Products Test Related Services

Home Page: www.aseglobal.com

26, Chin 3rd Road
Kaohsiung, 811
Taiwan
Phone: 886 7 361 7131


Officers

Name Title
Mr. Hung-Pen Chang Vice Chairman, GM & Pres
Mr. Joseph Tung Group CFO & Representative Director
Dr. Tien Yu Wu Group COO & Representative Director
Mr. Murphy Kuo Sr. VP, Accountant Mang. & Group Controller
Mr. Du-Tsuen Uang Chief Admin. Officer, Chief Corp. Governance Officer & Company Sec.
Mr. Kenneth Hsiang Head of Investor Relations & VP
Dr. Shi Hua Pan Group Chief of Staff
Mr. Rui Rong Lo GM of Kaohsiung Plant & Representative Director
Mr. Kwai Mun Lee Pres of Southeast Asia Operations
Mr. Bo-Lian Li Sr. VP

Exchange: TW

Country: TW : Taiwan

Currency: New Taiwan Dollar (NT$)

Forward PE: 8.1699
Trailing PE: 6.1398
Price-to-Book MRQ: 1.4572
Price-to-Sales TTM: 0.619
IPO Date: 1995-12-15
Fiscal Year End: December
Full Time Employees: 99104
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