China Wafer Level Csp Co Ltd(603005)

Description: China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.

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Keywords: Computing Electronics Semiconductor Packaging Electronic Engineering Integrated Circuits Electronics Manufacturing Turnkey Solutions Electronics Industry Infrastructure Solutions Flip Chip Wafer Level Packaging Reliability Testing Services High Volume Manufacturing

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Home Page: www.wlcsp.com

Suzhou Industrial Park
Suzhou, 215026
China
Phone: 86 512 6773 0001

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Officers

Exchange: SHG

Country: CN

Currency: Renminbi (¥)