Description: Hwatsing Technology Co., Ltd. manufactures semiconductor equipment products in China. The company offers chemical mechanical polishers, grinders, thinning equipment, liquid supply systems, distribution systems, film metrology equipment, wafer regeneration and reclaim services, and consumables and maintenance services. Its products are mainly used in integrated circuits, advanced packaging, advanced packaging, large silicon wafers, MEMS, micro-LED, and other third-generation semiconductors. The company was founded in 2013 and is headquartered in Tianjin, China.
Home Page: www.hwatsing.com
No. 11, Juxing Road
Tianjin,
300350
China
Phone:
86 22 5978 1962
Officers
| Name | Title |
|---|---|
| Mr. Xinchun Lu | Chairman of the Board & Chief Scientist |
| Mr. Guoming Zhang | GM & Director |
| Mr. Kun Li | Executive Deputy GM & Director |
| Mr. Huaixu Wang | Financial Director |
| Mr. Tongqing Wang | Deputy GM & Secretary of the Board |
Exchange: SHG
Country: CN : China
Currency: Renminbi (¥)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Semiconductors & Semiconductor Equipment |
| GIC Industry: | Semiconductors & Semiconductor Equipment |
| GIC Sub-Industry: | Semiconductor Materials & Equipment |
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 48.5202 |
| Price-to-Book MRQ: | 7.1199 |
| Price-to-Sales TTM: | 13.6612 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 1268 |