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Amtech Systems Inc(AS3)

Description: Amtech Systems, Inc. manufactures and sells capital equipment and related consumables for use in fabricating silicon carbide (SiC), silicon power devices, analog and discrete devices, electronic assemblies, and light-emitting diodes (LEDs) worldwide. The company operates through Semiconductor and Material and Substrate segments. The Semiconductor segment designs, manufactures, sells, and services thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics, and electro/mechanical assembly manufacturers; and diffusion and reflow thermal systems, as well as wafer cleaning equipment and related services. The Material and Substrate segment manufactures and sells consumables and machinery for lapping and polishing of materials, such as silicon wafers for semiconductor products; sapphire substrates for LED lighting and mobile devices; silicon carbide wafers for LED and power device applications; various glass and silica components for 3D image transmission; quartz and ceramic components for telecommunications devices; and medical device components, and optical and photonics applications. It also offers substrate products comprising of double-sided wafer cleaning system, entegrity head tester, substrate carrier, substrate polishing templates, double-sided lapping and polishing machines, single-sided polisher, and substrate process chemicals. The company sells its products through sales personnel, as well as a network of independent sales representatives and distributors. Amtech Systems, Inc. was incorporated in 1981 and is headquartered in Tempe, Arizona.


Keywords: Electronics Semiconductor Machinery Mobile Devices Semiconductor Device Fabrication Wafer Semiconductor Products Capital Equipment Silicon Carbide Rapid Thermal Processing Wafer Cleaning Equipment Substrate Products Telecommunications Devices

Home Page: www.amtechsystems.com

131 South Clark Drive
Tempe, AZ 85288
United States
Phone: 480 967 5146


Officers

Name Title
Mr. Robert C. Daigle President, Chairman & CEO
Mr. Wade Michael Jenke Chief Financial Officer
Mr. Jason Brown Vice President of Operations
Mr. Paul Lancaster Vice President of Sales & Corporate Development
Angi Larson Chief Human Resources Officer
Mr. Shashi Gupta Senior VP & GM of Semiconductor Fabrication Solutions

Exchange: F

Country: DE : Germany

Currency: Euro (€)

Forward PE: 27.7778
Trailing PE: 0
Price-to-Book MRQ: 0.967
Price-to-Sales TTM: 0.7305
IPO Date:
Fiscal Year End: September
Full Time Employees: 405
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