Description: Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. It offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; stacked die solutions in various package types, such as stacked die quad flat no-lead and hybrid BGAs containing stacked wire bond and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. The company's testing services include front-end test engineering testing, wafer probing, logic/mixed-signal/RF/discrete final testing services, memory final testing services, other test related services, and drop shipment services. It also offers electronics manufacturing services for use in a range of end-use applications, primarily computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.
Home Page: www.aseglobal.com
ASX Technical Analysis
26, Chin 3rd Road
Kaohsiung,
811
Taiwan
Phone:
886 7 361 7131
Officers
Name | Title |
---|---|
Mr. Hung-Pen Chang | Vice Chairman, GM & Pres |
Mr. Joseph Tung | Group CFO & Representative Director |
Dr. Tien Yu Wu | Group COO & Representative Director |
Mr. Murphy Kuo | Sr. VP, Accountant Mang. & Group Controller |
Mr. Du-Tsuen Uang | Chief Admin. Officer, Chief Corp. Governance Officer & Company Sec. |
Mr. Kenneth Hsiang | Head of Investor Relations & VP |
Dr. Shi Hua Pan | Group Chief of Staff |
Mr. Rui Rong Lo | GM of Kaohsiung Plant & Representative Director |
Mr. Kwai Mun Lee | Pres of Southeast Asia Operations |
Mr. Bo-Lian Li | Sr. VP |
Exchange: NYSE
Country: US
Currency: US Dollar ($)
GIC Sector: | Information Technology |
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GIC Group: | Semiconductors & Semiconductor Equipment |
GIC Industry: | Semiconductors & Semiconductor Equipment |
GIC Sub-Industry: | Semiconductors |
Forward PE: | 8.4674 |
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Trailing PE: | 6.4486 |
Price-to-Book MRQ: | 1.5115 |
Price-to-Sales TTM: | 0.0206 |
IPO Date: | 1995-12-15 |
Fiscal Year End: | December |
Full Time Employees: | 99104 |