Advanced Semiconductor Engineering, Inc.(ASX)

Description: Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. It offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; stacked die solutions in various package types, such as stacked die quad flat no-lead and hybrid BGAs containing stacked wire bond and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. The company's testing services include front-end test engineering testing, wafer probing, logic/mixed-signal/RF/discrete final testing services, memory final testing services, other test related services, and drop shipment services. It also offers electronics manufacturing services for use in a range of end-use applications, primarily computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.

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Keywords: Electronics Semiconductor Electrical Engineering Consumer Electronics Packaging Electronic Engineering Integrated Circuits Semiconductor Device Fabrication Electronics Manufacturing Semiconductor Devices Automotive Electronics Electronics Manufacturing Services Flip Chip Ball Grid Array Shipment Services Chip Scale Package Ase Group Final Testing Services End Use Applications Module Assembly Services Offers Electronics Semiconductor Package Semiconductor Packaging And Testing Services Server Applications Test Related Services

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Home Page: www.aseglobal.com

ASX Technical Analysis

26, Chin 3rd Road
Kaohsiung, 811
Taiwan
Phone: 886 7 361 7131

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Officers

Exchange: NYSE

Country: US

Currency: US Dollar ($)