Description: BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chips, multi chips, multi modules, flip chips, TCBs, FOWLP and hybrid die bonding systems, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company offers its products primarily to chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
Home Page: www.besi.com
Ratio 6
Duiven,
6921 RW
Netherlands
Phone:
31 26 319 4500
Officers
| Name | Title |
|---|---|
| Mr. Richard W. Blickman | Chairman of Management Board, Pres & CEO |
| Mr. Leon Verweijen | Sr. VP of Fin. |
| Mr. Henk-Jan Jonge Poerink | Sr. VP of Global Operations |
| Mr. Ruurd Boomsma | Chief Technology Officer |
| Edmond Franco | VP of Corp. Devel. |
| Mr. Rene W. Hendriks | Sr. VP of Sales - North America & Europe |
| Mr. Peter Wiedner | Sr. VP of Sub Micron Die Attach |
| Mr. Jong Kwon Park | Sr. VP of Sales & Customer Support - APAC |
| Mr. Jeroen Kleijburg | Sr. VP of Packaging |
| Mr. Christoph Scheiring | Sr. VP of Die Attach |
Exchange: PINK
Country: US
Currency: US Dollar ($)
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 17.6029 |
| Price-to-Book MRQ: | 5.7979 |
| Price-to-Sales TTM: | 8.8811 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 1694 |