BE SEMICON.INDS NY EO091(BSIA)

Description: BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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Keywords: Electronics Semiconductor Packaging Integrated Circuits Semiconductor Device Fabrication Precious Metal Electronics Manufacturing Electronics Industries Flip Chip Integrated Circuit Packaging Process Chemicals Wafer Level Packaging Singulation Systems Solar Plating Systems Semiconductor Assembly Equipment Besi Die Singulation Plating Equipment

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Home Page: www.besi.com

Ratio 6
Duiven, 6921 RW
Netherlands
Phone: 31 26 319 4500

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Officers

Exchange: F

Country: DE : Germany

Currency: Euro (€)