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Disco Corp(DISPF)

Description: Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. It also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters. In addition, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Further, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.


Keywords: Laser Metalworking Grinding Saws Sharpening Diamond Tool Training Services Dicing Saw Accessory Equipment Disco Corporation Precision Processing Tools

Home Page: www.disco.co.jp

13-11 Omori-Kita 2-chome
Tokyo, 143-8580
Japan
Phone: 81 3 4590 1111


Officers

Name Title
Mr. Kazuma Sekiya Representative Executive Officer, President, CEO, COO & Head of Technology Development Division
Mr. Takao Tamura Managing Exec Ofcr., CFO, Chief Env. & Privacy Officer, GM of Corp. Support Div. and Director
Mr. Noboru Yoshinaga Executive VP, Representative Executive Officer, GM of Sales Division & Director
Naoki Abe Managing Executive Officer & GM of Manufacturing Division
Yutaka Nishimura Executive Officer, Office Manager, Information Systems Manager & Hiroshima General Affairs Manager

Exchange: OTCGREY

Country: US : United States of America

Currency: US Dollar ($)

Forward PE: 28.2486
Trailing PE: 47.4218
Price-to-Book MRQ: 11.084
Price-to-Sales TTM: 0.0938
IPO Date:
Fiscal Year End: March
Full Time Employees: 4886
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