Description: Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. It also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters. In addition, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Further, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.
Home Page: www.disco.co.jp
13-11 Omori-Kita 2-chome
Tokyo,
143-8580
Japan
Phone:
81 3 4590 1111
Officers
| Name | Title |
|---|---|
| Mr. Kazuma Sekiya | CEO, Pres, COO, CIO, Gen. Mang. of Engineering R&D Division and Representative Director |
| Noboru Yoshinaga | Exec. VP, GM of Sales Division & Director |
| Mr. Takao Tamura | CFO, Chief Environmental & Privacy Officer, GM of Corp. Support Div. and Director |
| Naoki Abe | Managing Exec. Officer & GM of Manufacturing Division |
Exchange: OTCGREY
Country: US
Currency: US Dollar ($)
| Forward PE: | 18.5874 |
|---|---|
| Trailing PE: | 17.9673 |
| Price-to-Book MRQ: | 3.6672 |
| Price-to-Sales TTM: | 0.0372 |
| IPO Date: | |
| Fiscal Year End: | March |
| Full Time Employees: | 4258 |