Description: Egide S.A., together with its subsidiaries, designs, manufactures, and sells hermetic packages to protect and interconnect various types of electronic or photonic chips in France, rest of the European Union, North America, and internationally. The company offers ceramic-to-metal-seal, glass-to-metal-seal, high temperature co-fired ceramic, power, opto-electronics, and microwave/RF packages, as well as inks. It also provides thermal management materials, plating services, precision machining, package assembly, specialized sealing/brazing/soldering, and testing and inspection services. The company serves aerospace, defense, medical, opto-electronics, infra-red, sensors, RF, communications, and other markets, as well as civil aeronautics and security markets. Egide S.A. was incorporated in 1986 and is headquartered in Bollène, France.
Home Page: www.egide-group.com
Site Sactar-CS 20205
Bollène,
84505
France
Phone:
33 4 90 30 97 11
Officers
| Name | Title |
|---|---|
| Mr. David Hien | CEO & Director |
| Mr. Philippe Bringuier | Chief Financial Officer |
| Mr. Philippe Brégi | President of Egide USA LLC, President of Egide UK Ltd & President of Egide USA Inc |
Exchange: F
Country: DE : Germany
Currency: Euro (€)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Technology Hardware & Equipment |
| GIC Industry: | Electronic Equipment, Instruments & Components |
| GIC Sub-Industry: | Electronic Components |
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 0 |
| Price-to-Book MRQ: | 1.1281 |
| Price-to-Sales TTM: | 0.1847 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 229 |