Description: KLA-Tencor Corporation engages in design, manufacture, and marketing of process control and yield management solutions for the semiconductor and related nanoelectronics industries worldwide. It provides a portfolio of defect inspection and metrology products, as well as related service, software, and other offerings. The company offers inline wafer and integrated circuit (IC) defect monitoring, review, and classification; reticle defect inspection and metrology; packaging and interconnect inspection; critical dimension metrology; pattern overlay metrology; film thickness, surface topography, and composition measurements; measurement of in-chamber process conditions, wafer shape, and stress metrology; computational lithography tools; and yield and fab-wide data management and analysis systems. KLA-Tencor Corporation offers its products and services for bare wafer, IC, lithography reticle, and disk manufacturers. It also serves light emitting diode and data storage industries, as well as general materials research industries. KLA-Tencor Corporation was founded in 1975 and is headquartered in Milpitas, California.
Home Page: www.kla.com
KLAC Technical Analysis
One Technology Drive
Milpitas,
CA
95035
United States
Phone:
408 875 3000
Officers
| Name | Title |
|---|---|
| Mr. Richard P. Wallace | Pres, CEO & Exec. Director |
| Mr. Bren D. Higgins | Exec. VP & CFO |
| Ms. Mary Beth Wilkinson | Exec. VP, Chief Legal Officer & Corp. Sec. |
| Mr. Ahmad A. Khan | Pres of Semiconductor Process Control |
| Mr. Oreste Donzella | Exec. VP of Electronics, Packaging & Components |
| Mr. Virendra A. Kirloskar | Sr. VP & Chief Accounting Officer |
| Dr. Ben Bin-Ming Tsai | CTO & Exec. VP of Corp. Alliances |
| Mr. Kevin M. Kessel C.F.A. | VP of Investor Relations |
| Becky Howland Ph.D. | Sr. Director of Corp. Communications |
| Randi Polanich | VP & Chief Communications Officer |
Exchange: NASDAQ
Country: US : United States of America
Currency: US Dollar ($)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Semiconductors & Semiconductor Equipment |
| GIC Industry: | Semiconductors & Semiconductor Equipment |
| GIC Sub-Industry: | Semiconductor Equipment |
| Forward PE: | 14.5985 |
|---|---|
| Trailing PE: | 18.8102 |
| Price-to-Book MRQ: | 36.2941 |
| Price-to-Sales TTM: | 5.5342 |
| IPO Date: | 1980-10-08 |
| Fiscal Year End: | June |
| Full Time Employees: | 14000 |