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Kulicke and Soffa Industries, Inc.(KLIC)

Description: Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices, including integrated circuits, discrete devices, light-emitting diodes, and power modules. It also services, maintains, repairs, and upgrades its equipment. The company operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; heavy wire wedge bonders for the power semiconductor and automotive power module markets; wafer level bonders, which mechanically apply bumps to die, while still in the wafer format, for some variants of the flip chip assembly process; and die bonders that are used to attach a die to the substrate or lead frame, which will house the semiconductor device. The Expendable Tools segment provides various expendable tools for a range of semiconductor packaging applications. Its products include capillaries, which are used in ball bonders; bonding wedges for wedge bonders; and saw blades to cut silicon wafers into individual semiconductor die, as well as to cut semiconductor devices that have been molded in a matrix configuration into individual units. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.


Keywords: Semiconductor Electrical Engineering Electronic Engineering Integrated Circuits Semiconductor Device Fabrication Light Emitting Diodes Semiconductor Devices Wafer Automotive Electronics Diodes Device Manufacturers Capital Equipment Flip Chip Electronics Manufacturers Power Semiconductor

Home Page: www.kns.com

KLIC Technical Analysis

No. 01-01, 23A Serangoon North Avenue 5
Singapore, 554369
Singapore
Phone: 65 6880 9600


Officers

Name Title
Dr. Fusen Ernie Chen Pres, CEO & Director
Mr. Lester A. Wong Exec. VP of Fin. & IT and CFO
Mr. Stephen Ray Drake J.D. VP of Legal Affairs & Gen. Counsel
Mr. Mun Pun Wong Sr. VP of Global Sales & Global Supply Chain
Mr. Chan Pin Chong Exec. VP and GM of K&S Products and Solutions
Mr. Robert Nestor Chylak Sr. VP of Central Engineering & CTO
Mr. Joseph Elgindy Sr. Director of Investor Relations & Strategic Planning
Ms. Lisa Lim VP of Global HR
Mr. Lien Lee Ang Global Head of IT and Sr. Director
Ms. Susan Waters Sec.

Exchange: NASDAQ

Country: US : United States of America

Currency: US Dollar ($)

Forward PE: 0
Trailing PE: 6.7659
Price-to-Book MRQ: 2.3
Price-to-Sales TTM: 1.8058
IPO Date: 1990-03-26
Fiscal Year End: September
Full Time Employees: 2944
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