Description: MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards. The company offers various chemicals for electronic substrates, such as roughening type adhesion enhancement; rolled annealed copper roughening treatment; pre-lamination treatment of multilayer substrates and adhesion enhancement for high-frequency substrates; anisotropic etching and seed layer etching; copper surface treatment for CO2 laser direct drilling; degreasing, rust removal, temporary anti-tarnish; other metal surface treatment; DFR pre-treatment; microetching; and various residue removal treatment. It also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.
Home Page: www.mec-co.com
3-4-1, Kuise Minamishimmachi
Amagasaki,
660-0822
Japan
Phone:
81 6 6401 8160
Officers
| Name | Title |
|---|---|
| Mr. Kazuo Maeda | CEO, President & Representative Director |
| Mr. Toshiko Nakagawa | Director, CFO & Managing Executive Officer, Head of Corporate Planning Division |
| Mr. Sadamitsu Sumitomo | Director & Executive Operating Officer of Global Operations |
Exchange: PINK
Country: US : United States of America
Currency: US Dollar ($)
| Forward PE: | 0 |
|---|---|
| Trailing PE: | 28.7356 |
| Price-to-Book MRQ: | 2.9653 |
| Price-to-Sales TTM: | 0.0264 |
| IPO Date: | |
| Fiscal Year End: | December |
| Full Time Employees: | 454 |