Description: Soitec S.A. designs and produces semiconductor materials worldwide. It offers silicon-on-insulator (SOI) wafers for processor and connectivity system on chips (SoCs), including partially-depleted SOI, fully-depleted SOI, and FinFET products. The company also provides SOIs for RF front-end modules, including RFeSI-enhanced signal integrity substrates, HR-SOI substrates, and stacking for RF substrates. In addition, it offers SOI wafers for manufacturing smart power ICs; and photonics-SOIs for high-speed optical transceivers in data centers. The company's products are used to manufacture chips for consumer electronics devices and mobile electronics in smartphones, automotive applications, the Internet of Things, datacenters, etc. The company has a strategic collaboration with Samsung Electronics Co., Ltd. for the supply of silicon-on-insulator wafers; and strategic partnership with Shanghai Simgui Technology Co., Ltd. to deliver RF-SOI and Power-SOI products. Soitec S.A. was founded in 1992 and is headquartered in Bernin, France.
Home Page: www.soitec.com
Parc Technologique des Fontaines
Bernin,
38190
France
Phone:
33 4 76 92 75 00
Officers
Name | Title |
---|---|
Mr. Pierre Barnabe | CEO & Director |
Ms. Lea Alzingre | Executive VP & CFO |
Mr. Cyril Menon | Senior EVP of Operations Excellence & Quality and COO |
Mr. Christophe Maleville | Senior EVP of Innovation & CTO |
Mr. Steve Babureck | Executive Vice President of Strategy & Investor Relations |
Ms. Caroline Sasia | Executive VP, Head of Communications & Chief of Staff to the Chief Executive Officer |
Ms. Jeannette Schuh | Executive VP & Chief Human Resources Officer |
Mr. Yvon Pastol | Executive Vice President of Customer Group |
Mr. Rene Jonker | Executive Vice President of Smart Devices |
Mr. Emmanuel Sabonnadière Ph.D. | Executive Vice President of Automotive & Industrial Division |
Exchange: PINK
Country: US : United States of America
Currency: US Dollar ($)
GIC Sector: | Information Technology |
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GIC Group: | Semiconductors & Semiconductor Equipment |
GIC Industry: | Semiconductors & Semiconductor Equipment |
GIC Sub-Industry: | Semiconductor Materials & Equipment |
Forward PE: | 15.1745 |
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Trailing PE: | 27.6515 |
Price-to-Book MRQ: | 2.0792 |
Price-to-Sales TTM: | 3.5035 |
IPO Date: | |
Fiscal Year End: | March |
Full Time Employees: | 2070 |