Description: Soitec SA designs and manufactures semiconductor materials worldwide. Its products are used to manufacture chips that are used in smart phones, tablets, computers, IT servers, and data centers, as well as electronic components in cars, connected devices, and industrial and medical equipment. It provides CONNECT Radio Frequency Silicon-on-Insulator (RF-SOI) for smartphone front-end modules; CONNECT Piezoelectric-on-Insulator RF filters for smartphone; and CONNECT RF gallium nitride for 5g infrastructure base stations and smartphones, as well as CONNECT Fully Depleted Silicon-On-Insulator (FD-SOI). The company also offers Auto Power-SOI product for automotive and industrial markets; Auto Smartsic for green mobility; and AUTO POWER-allium nitride for power efficiency, as well as AUTO FD-SOI for automotive radar and processors. In addition, it provides Smart photonics-SOI products for optical networking; Smart Imager-SOI products for next generation 3D image sensing; Smart FD-SOI for ultra low power, energy efficient, and body biasing; smart partially depleted (PD) -SOI for high-performance computing markets. Soitec SA was incorporated in 1992 and is headquartered in Bernin, France.
Home Page: www.soitec.com
Parc Technologique des Fontaines
Bernin,
38190
France
Phone:
33 4 76 92 75 00
Officers
| Name | Title |
|---|---|
| Mr. Pierre Barnabe | CEO & Director |
| Ms. Lea Alzingre | Executive VP & CFO |
| Mr. Cyril Menon | Senior EVP of Operations Excellence & Quality and COO |
| Mr. Christophe Maleville | Senior EVP of Innovation & CTO |
| Mr. Steve Babureck | Executive Vice President of Strategy & Investor Relations |
| Ms. Caroline Sasia | Executive VP, Head of Communications & Chief of Staff to the Chief Executive Officer |
| Ms. Jeannette Schuh | Executive VP & Chief Human Resources Officer |
| Mr. Yvon Pastol | Executive Vice President of Customer Group |
| Mr. Rene Jonker | Executive Vice President of Smart Devices |
| Mr. Emmanuel Sabonnadière Ph.D. | Executive Vice President of Automotive & Industrial Division |
Exchange: PA
Country: FR : France
Currency: Euro (€)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Semiconductors & Semiconductor Equipment |
| GIC Industry: | Semiconductors & Semiconductor Equipment |
| GIC Sub-Industry: | Semiconductor Materials & Equipment |
| Forward PE: | 15.0602 |
|---|---|
| Trailing PE: | 13.655 |
| Price-to-Book MRQ: | 2.0643 |
| Price-to-Sales TTM: | 3.155 |
| IPO Date: | |
| Fiscal Year End: | March |
| Full Time Employees: | 2070 |