Description: TTM Technologies, Inc., together with its subsidiaries, manufactures and sells mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB) worldwide. The company operates in two segments, PCB and RF&S Components. It offers range of engineered systems, RF and microwave assemblies, HDI PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration, IC substrates, passive RF components, advanced ceramic RF components, hi-reliability multi-chip modules, beamforming and switching networks, PCB products, RF components, and backplane/custom assembly solutions, including conventional PCBs. It also provides advanced ceramic RF components including standard and etched thick-film ceramic substrates; and hi-reliability multi-chip modules. In addition, the company offers radar systems including maritime surveillance and weather avoidance radar systems, surveillance products, communication systems, RF assembly and test services, and passive RF components. Further, the company provides custom designed application specific integrated circuits, high density interconnect, IC substrates, flexible and rigid flex PCBs, and custom assemblies including backplane and mid-plane assemblies, flexible and rigid-flex assemblies, and RF assemblies, as well as conventional PCBs, such as single-sided, double-sided, and multi-layer boards. Additionally, it offers quick turnaround services, which includes prototype production and ramp-to-volume production, and thermal management. The company serves original equipment manufacturers and electronic manufacturing services providers, original design manufacturers, distributors, and government agencies; and aerospace and defense, data center computing, automotive, medical, industrial, and instrumentation, as well as networking applications. TTM Technologies, Inc. was incorporated in 1978 and is headquartered in Santa Ana, California.
Home Page: www.ttm.com
200 East Sandpointe
Santa Ana,
CA
92707
United States
Phone:
714 327 3000
Officers
Name | Title |
---|---|
Mr. Thomas T. Edman | President, CEO & Director |
Mr. Daniel L. Boehle CPA | Executive VP & CFO |
Mr. Philip Titterton | Executive VP & COO |
Mr. Douglas L. Soder | Executive VP & President of Commercial Sector |
Ms. Catherine A. Gridley | Executive VP and President of Aerospace & Defense (A&D) Sector |
Mr. Sameer Desai | Vice President of Corporate Development & Investor Relations |
Mr. Daniel J. Weber | Executive VP, General Counsel & Corporate Secretary |
Mr. O. Clay Swain | Senior Vice President of Marketing |
Mr. Anthony J. Sandeen | Senior Vice President of AMI&I & Global Sales |
Mr. Shawn Powers | Executive VP & Chief Human Resources Officer |
Exchange: F
Country: DE : Germany
Currency: Euro (€)
GIC Sector: | Information Technology |
---|---|
GIC Group: | Technology Hardware & Equipment |
GIC Industry: | Electronic Equipment, Instruments & Components |
GIC Sub-Industry: | Electronic Components |
Forward PE: | 0 |
---|---|
Trailing PE: | 37.0968 |
Price-to-Book MRQ: | 1.6047 |
Price-to-Sales TTM: | 1.019 |
IPO Date: | |
Fiscal Year End: | December |
Full Time Employees: | 15800 |