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Chipbond Technology(6147)

Description: Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan.


Keywords: Electronics Metals Semiconductor Electronic Engineering Integrated Circuits Dielectric Semiconductor Device Fabrication After Sales Services Wafer Manufacturing Services Flip Chip Integrated Circuit Packaging Turnkey Services Circuit Products Failure Analysis Services Redistribution Layer Services

Home Page: www.chipbond.com.tw

No. 3, Lixing 5th Road
Hsinchu City, 300
Taiwan
Phone: 886 3 567 8788


Officers

Name Title
Mr. Fei-Jain Wu Chairman, CEO and R&D Officer
Mr. Huo-Wen Gau Pres & Director
Mr. Shi-wei Luo CFO, Corp. Governance Officer, SVP of Management Center & Company Sec.
Ms. Chao-Yi Wang Accounting Director & Sr. Director of Investment Division
Mr. In-Shek Hsu Sr. VP of Sales/MKT Planning Center
Mr. Cheng-Hung Shih Sr. VP of Hukou Operation Center
Mr. Sheng-Jen Wu Sr. VP of Manufacturing Center
Pei-Chun Tsai Chief Auditing Officer

Exchange: TWO

Country: TW

Currency: New Taiwan Dollar (NT$)

Forward PE: 9.9502
Trailing PE: 6.7442
Price-to-Book MRQ: 1.1185
Price-to-Sales TTM: 1.7169
IPO Date:
Fiscal Year End: December
Full Time Employees: 0
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