Description: Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan.
Home Page: www.chipbond.com.tw
No. 3, Lixing 5th Road
Hsinchu City,
300
Taiwan
Phone:
886 3 567 8788
Officers
Name | Title |
---|---|
Mr. Fei-Jain Wu | Chairman, CEO and R&D Officer |
Mr. Huo-Wen Gau | Pres & Director |
Mr. Shi-wei Luo | CFO, Corp. Governance Officer, SVP of Management Center & Company Sec. |
Ms. Chao-Yi Wang | Accounting Director & Sr. Director of Investment Division |
Mr. In-Shek Hsu | Sr. VP of Sales/MKT Planning Center |
Mr. Cheng-Hung Shih | Sr. VP of Hukou Operation Center |
Mr. Sheng-Jen Wu | Sr. VP of Manufacturing Center |
Pei-Chun Tsai | Chief Auditing Officer |
Exchange: TWO
Country: TW
Currency: New Taiwan Dollar (NT$)
Forward PE: | 9.9502 |
---|---|
Trailing PE: | 6.7442 |
Price-to-Book MRQ: | 1.1185 |
Price-to-Sales TTM: | 1.7169 |
IPO Date: | |
Fiscal Year End: | December |
Full Time Employees: | 0 |