Description: KLA Corporation, together with its subsidiaries, engages in the design, manufacture, and marketing of process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems that are used to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. It also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, the company offers direct imaging, inspection, optical shaping, inkjet and additive printing, UV laser drilling, and computer-aided manufacturing and engineering solutions for the PCB market; inspection and electrical testing systems to identify and classify defects, as well as systems to repair defects for the display market; and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Home Page: www.kla.com
One Technology Drive
Milpitas,
CA
95035
United States
Phone:
408 875 3000
Officers
| Name | Title |
|---|---|
| Mr. Richard P. Wallace | President, CEO & Executive Director |
| Mr. Bren D. Higgins | Executive VP & CFO |
| Mr. Ahmad A. Khan | President of Semiconductor Process Control, Electronics, Packaging Components, & KLA Instruments |
| Mr. Brian W. Lorig | Executive Vice President of Global Support & Services |
| Mr. Virendra A. Kirloskar | Senior VP & Chief Accounting Officer |
| Dr. Ben Bin-Ming Tsai | CTO & Executive VP of Corporate Alliances |
| Mr. Kevin M. Kessel C.F.A. | Vice President of Investor Relations |
| Ms. Mary Beth Wilkinson | Executive VP, Chief Legal Officer & Corporate Secretary |
| Ms. Randi Polanich | Senior VP & Chief Communications Officer |
| Mr. John Van Camp | Executive VP & Chief Human Resources Officer |
Exchange: F
Country: DE : Germany
Currency: Euro (€)
| GIC Sector: | Information Technology |
|---|---|
| GIC Group: | Semiconductors & Semiconductor Equipment |
| GIC Industry: | Semiconductors & Semiconductor Equipment |
| GIC Sub-Industry: | Semiconductor Materials & Equipment |
| Forward PE: | 21.5517 |
|---|---|
| Trailing PE: | 29.2453 |
| Price-to-Book MRQ: | 24.0442 |
| Price-to-Sales TTM: | 7.9721 |
| IPO Date: | |
| Fiscal Year End: | June |
| Full Time Employees: | 15000 |